JPS635240Y2 - - Google Patents
Info
- Publication number
- JPS635240Y2 JPS635240Y2 JP1982058888U JP5888882U JPS635240Y2 JP S635240 Y2 JPS635240 Y2 JP S635240Y2 JP 1982058888 U JP1982058888 U JP 1982058888U JP 5888882 U JP5888882 U JP 5888882U JP S635240 Y2 JPS635240 Y2 JP S635240Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead piece
- resin
- semiconductor device
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982058888U JPS58162642U (ja) | 1982-04-22 | 1982-04-22 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982058888U JPS58162642U (ja) | 1982-04-22 | 1982-04-22 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58162642U JPS58162642U (ja) | 1983-10-29 |
| JPS635240Y2 true JPS635240Y2 (en]) | 1988-02-12 |
Family
ID=30069241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982058888U Granted JPS58162642U (ja) | 1982-04-22 | 1982-04-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58162642U (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6116702Y2 (en]) * | 1977-07-01 | 1986-05-22 | ||
| JPS5572065A (en) * | 1978-11-25 | 1980-05-30 | Mitsubishi Electric Corp | Plastic-molded type semiconductor device |
-
1982
- 1982-04-22 JP JP1982058888U patent/JPS58162642U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58162642U (ja) | 1983-10-29 |
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